Light emitting device and method of manufacturing the same

ABSTRACT

A light emitting device includes: a substrate; a first electrode and a second electrode on the substrate and spaced apart from each other; a light emitting diode between the first electrode and the second electrode and connected to the first and second electrodes; a first contact on the first electrode; and a second contact on the second electrode. The first contact contacts the first electrode and a first portion of the light emitting diode, and the second contact contacts the second electrode and a second portion of the light emitting diode.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/927,678, filed Mar. 21, 2018, which claims priority to and thebenefit of Korean Patent Application No. 10-2017-0122625, filed Sep. 22,2017, the entire content of both of which is incorporated herein byreference.

BACKGROUND 1. Field

The described technology relates generally to a light emitting deviceand a method of manufacturing the same.

2. Description of the Related Art

In general, a light emitting diode is an element that emits light (e.g.,light having a certain or predetermined wavelength) corresponding to anelectric signal received through electrodes that are respectivelyconnected to opposite ends of the light emitting diode.

Recently, a light emitting device in which nano-sized light emittingdiodes are sprayed on neighboring electrodes by using a spray device,such as an inkjet printer, and are then aligned on the electrodes byforming an electric field between the electrodes has been researched anddeveloped.

The above information disclosed in this Background section is forenhancement of understanding of the background of the describedtechnology, and therefore, it may contain information that does not formprior art.

SUMMARY

The described technology may prevent (or reduce the occurrence of) ashort circuit occurring between two electrodes on a substrate duringalignment of the light emitting diodes due to the presence of unintendedor undesired particles.

Further, embodiments of the present invention provide a light emittingdevice in which a number of light emitting diodes provided between twoelectrodes is increased, and a method of manufacturing the same.

One embodiment of the present invention provides a light emitting deviceincluding: a substrate; a first electrode and a second electrode on thesubstrate and spaced apart from each other; a light emitting diodebetween the first electrode and the second electrode; a first contact onthe first electrode; and a second contact on the second electrode. Thelight emitting diode is connected to the first electrode and the secondelectrode, the first contact contacts the first electrode and a firstportion of the light emitting diode, and the second contact contacts thesecond electrode and a second portion of the light emitting diode.

The light emitting device may further include an insulation patternbetween the first contact and the second contact.

The insulation pattern may contact the first contact, the secondcontact, and the light emitting diode.

The insulation pattern may be a single layer.

The insulation pattern may completely cover the first electrode.

The insulation pattern may partially cover the first electrode.

The first contact may not extend beyond the first electrode and thelight emitting diode.

The light emitting diode may include a plurality of light emittingdiodes, and the plurality of light emitting diodes may be connected tothe first electrode and the second electrode.

The plurality of light emitting diodes may include first light emittingdiodes, and at least one of first and second ends of each of the firstlight emitting diodes may contact at least one of the first electrode orthe second electrode.

The plurality of light emitting diodes may include second light emittingdiodes, and one end and another end of each of the second light emittingdiodes may contact the substrate.

The light emitting device may further include a first protrusion betweenthe substrate and the second electrode.

The light emitting device may further include a second protrusionbetween the substrate and the first electrode.

Another embodiment of the present invention provides a method ofmanufacturing a light emitting device. The method includes: coating aplurality of light emitting diodes on a first electrode and a secondelectrode; aligning the plurality of light emitting diodes between thefirst electrode and the second electrode by forming an electric fieldbetween the first electrode and the second electrode; forming a firstcontact layer covering the first electrode, the second electrode, andthe plurality of light emitting diodes; forming a first contactcontacting the first electrode and a first portion of the light emittingdiode by etching the first contact layer using a mask; and forming asecond contact contacting the second electrode and a second portion ofthe light emitting diode. The first and second electrodes are spacedapart from each other on a substrate.

The method may further include forming an insulation pattern between thefirst contact and the second contact.

The forming of the first contact may include removing particles formedon the substrate and contacting the first contact layer.

A light emitting device in which a number of light emitting diodesprovided between two electrodes is increased and a method ofmanufacturing the same is be provided.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top plan view of a light emission device according to anexemplary embodiment.

FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1.

FIG. 3 is a flowchart of a method of manufacturing a light emittingdevice according to another exemplary embodiment.

FIGS. 4-7 are cross-sectional views of the method of manufacturing thelight emitting device according to exemplary embodiment illustrated inFIG. 3.

FIG. 8 is a cross-sectional view of a light emitting device according toanother exemplary embodiment.

FIG. 9 is a cross-sectional view of a light emitting device according tostill another exemplary embodiment.

FIG. 10 is a cross-sectional view of a light emitting device accordingto still another exemplary embodiment.

FIG. 11 is a cross-sectional view of a light emitting device accordingto still another exemplary embodiment.

FIG. 12 is a cross-sectional view of a light emitting device accordingto still another exemplary embodiment.

DETAILED DESCRIPTION

Hereinafter, exemplary embodiments of the present invention will bedescribed in more detail with reference to the accompanying drawings.The present invention, however, may be embodied in various differentforms and should not be construed as being limited to the exemplaryembodiments illustrated herein.

The drawings and description are to be regarded as illustrative innature and not restrictive. Like reference numerals designate likeelements throughout the specification.

In addition, the size and thickness of each configuration shown in thedrawings may be arbitrarily shown for better understanding and ease ofdescription, and the present invention is not limited thereto. Forexample, in the drawings, the thickness of layers, films, panels,regions, etc., may be exaggerated for clarity.

It will be understood that when an element such as a layer, film,region, or substrate is referred to as being “on” another element, itcan be directly on the other element or intervening elements may also bepresent. When an element is referred to as being “directly on” anotherelement, there are no intervening elements present. Further, the word“over” or “on” means positioning on or below the object portion and doesnot essentially mean positioning on the upper side of the object portionbased on a gravity direction.

It will be understood that when an element or layer is referred to asbeing “on,” “connected to,” or “coupled to” another element or layer, itmay be directly on, connected, or coupled to the other element or layeror one or more intervening elements or layers may also be present. Whenan element or layer is referred to as being “directly on,” “directlyconnected to,” or “directly coupled to” another element or layer, thereare no intervening elements or layers present. For example, when a firstelement is described as being “coupled” or “connected” to a secondelement, the first element may be directly coupled or connected to thesecond element or the first element may be indirectly coupled orconnected to the second element via one or more intervening elements.Further, the use of “may” when describing embodiments of the presentinvention relates to “one or more embodiments of the present invention.”Expressions, such as “at least one of,” when preceding a list ofelements, modify the entire list of elements and do not modify theindividual elements of the list. Also, the term “exemplary” is intendedto refer to an example or illustration. As used herein, the terms “use,”“using,” and “used” may be considered synonymous with the terms“utilize,” “utilizing,” and “utilized,” respectively.

In addition, unless explicitly described to the contrary, the word“include” and “comprise” and variations thereof, such as “includes,”including,” “comprises,” and/or “comprising” will be understood to implythe inclusion of stated elements but not the exclusion of any otherelements.

It will be understood that, although the terms first, second, third,etc. may be used herein to describe various elements, components,regions, layers, and/or sections, these elements, components, regions,layers, and/or sections should not be limited by these terms. Theseterms are used to distinguish one element, component, region, layer, orsection from another element, component, region, layer, or section.Thus, a first element, component, region, layer, or section discussedbelow could be termed a second element, component, region, layer, orsection without departing from the teachings of example embodiments.

Hereinafter, a light emitting diode (LED) display according to anexemplary embodiment will be described with reference to FIGS. 1 and 2.

FIG. 1 is a top plan view of a light emitting diode display according toan exemplary embodiment. FIG. 2 is a cross-sectional view taken alongthe line II-II of FIG. 1.

Referring to FIGS. 1 and 2, a light emitting device according to anexemplary embodiment that emits light by using a plurality of nano-sizedlight emitting diodes is illustrated.

The light emitting device 1000 includes a substrate 100, a firstelectrode 201, a second electrode 202, a plurality of light emittingdiodes 300, a first protrusion (e.g., a first protrusion portion) 500, afirst contact (e.g., a first contact portion) 600, a second contact(e.g., a second contact portion) 700, and an insulation pattern 800.

The substrate 100 may include (or may be formed of) at least one ofglass, an organic material, an inorganic material, a metal, or the like.The substrate 100 may be flexible, foldable, or bendable. The substrate100 includes a substrate main body 110 and a buffer layer 120 that isdisposed on the substrate main body 110. The substrate main body 110 mayinclude (or may be formed of) at least one of the above-stated glass,organic material, inorganic material, or metal. The buffer layer 120 maybe disposed on the entire surface (e.g., the entire upper surface) ofthe substrate main body 110. The buffer layer 120 may include (or may beformed of) at least one of glass, an organic material, an inorganicmaterial, or the like.

The first electrode 201 is disposed on the substrate 100, extends (e.g.,primarily extends) in a first direction X, and is branched a pluralityof times in a second direction Y that crosses the first direction X.

The second electrode 202 is disposed on the substrate 100 and isseparated or spaced from the first electrode 201. The second electrode202 extends in the first direction X while being branched a plurality oftimes in the second direction Y.

The first electrode 201 and the second electrode 202 are alternatelydisposed or arranged along the first direction X.

The first electrode 201 and the second electrode 202 respectively havestraight-line shapes (e.g., straight or substantially straight edges),but the present invention is not limited thereto. The first electrode201 and the second electrode 202 may have curved-line shapes.

The first electrode 201 and the second electrode 202 are disposed on asame plane (e.g., at a same level) on the substrate 100, but the presentinvention is not limited thereto. The first electrode 201 and the secondelectrode 202 may be disposed on different planes on the substrate 100.

The first electrode 201 and the second electrode 202 may be concurrently(or simultaneously) formed through one process, but the presentinvention is not limited thereto. They may be sequentially formedthrough different processes.

The plurality of light emitting diodes 300 are disposed between (e.g.,are disposed to extend between) the first electrode 201 and the secondelectrode 202. The plurality of light emitting diodes 300 are connectedto the first electrode 201 and the second electrode 202.

The plurality of light emitting diodes 300 are substantially nano-sized.For example, the light emitting diodes 300 may be approximately 12microns long

The plurality of light emitting diodes 300 may include various knownlight emitting diodes included in a light emitting device, but thepresent invention is not limited thereto. Any suitable ones of variousknown light emitting diodes included in a display device can be used.

Each of the plurality of light emitting diodes 300 may have one ofvarious shapes, such as a cylindrical, a triangular column, aquadrangular column, conical, and the like.

The plurality of light emitting diodes 300 are coated on the firstelectrode 201 and the second electrode 202 in solution by a coatingdevice, such as an inkjet printer, and may then be arranged between thefirst electrode 201 and the second electrode 202 by an electromagneticfield formed between the first electrode 201 and the second electrode202.

Here, the solution may be an ink or paste in which the plurality oflight emitting diodes 300 are mixed in a solvent.

Each of the plurality of light emitting diodes 300 has an aspect ratio,and the light emitting diodes 300 are aligned in various suitabledirections (e.g., various suitable directions with respect to the firstand second directions X and Y) between the first electrode 201 and thesecond electrode 202.

The plurality of light emitting diodes 300 includes first light emittingdiodes 301 and second light emitting diodes 302.

At least one of a first end or a second end of the first light emittingdiode 301 contacts at least one of the first electrode 201 or the secondelectrode 202. For example, at least one of opposite ends of each firstlight emitting diode 301 is disposed on at least one of the firstelectrode 201 and the second electrode 202, and each first lightemitting diode 301 overlaps at least one of the first electrode 201 andthe second electrode 202.

A first end and a second end of the second light emitting diode 302contact the substrate 100. For example, opposite ends of the secondlight emitting diode 302 contact the substrate 100, and the second lightemitting diode 302 does not overlap either the first electrode 201 orthe second electrode 202.

The first protrusion 500 is disposed between the substrate 100 and thesecond electrode 202. The first protrusion 500 protrudes upwardly from asurface of the substrate 100. A portion of the second electrode 202 thatis disposed on the surface of the first protrusion 500 protrudesupwardly.

Light emitted from the plurality of light emitting diodes 300 andirradiated in a direction toward the first protrusion 500 may bereflected in a top side direction (e.g., in a direction away from thesubstrate 100) by the portion of the second electrode 202 that protrudesdue to the first protrusion 500. Accordingly, light emission efficiencyof the plurality of light emitting diodes 300 may be improved.

The first contact 600 is disposed on the first electrode 201, andcontacts the first electrode 201 and a first portion of the plurality oflight emitting diodes 300. The first contact 600 may include atransparent conductive material, but the present invention is notlimited thereto. In the illustrated embodiment, the first portion of thelight emitting diode 300 is one end of the light emitting diodes 300.

In some embodiments, the entire first contact 600 contacts the firstelectrode 201 or the light emitting diode 300 (e.g., the first contact600 does not extend beyond the first electrode 201 and the lightemitting diode 300).

The second contact 700 is disposed on the second electrode 202, andcontacts the second electrode 202 and a second portion of the pluralityof light emitting diodes 300. The second contact 700 may include atransparent conductive material, but the present invention is notlimited thereto. In the illustrated embodiment, the second portion ofthe light emitting diodes 300 is the other end of the light emittingdiode 300.

A portion of the first contact 600 and a portion of the second contact700 overlap each other on the plurality of light emitting diodes 300.

The plurality of light emitting diodes 300 disposed between the firstelectrode 201 and the second electrode 202 are connected to the firstelectrode 201 and the second electrode 202 via the first contact 600 andthe second contact 700.

For example, the first light emitting diode 301 from among the pluralityof light emitting diodes 300 may be directly connected to the firstelectrode 201 and the second electrode 202 by contacting the firstelectrode 201 and the second electrode 202, respectively, or may beindirectly connected to the first electrode 201 and the second electrode202. However, because the second contact 700 contacts the secondelectrode 202 and the first portion of the second light emitting diode302 and the first contact 600 contacts the first electrode 201 and thesecond portion of the second light emitting diode 302, the second lightemitting diode 302 is connected with the first electrode 201 and thesecond electrode 202.

Because the plurality of light emitting diodes 300 are connected to thefirst electrode 201 and the second electrode 202 by the first contact600 and the second contact 700, the plurality of light emitting diodes300 are connected to the first electrode 201 and the second electrode202 even though some of the light emitting diodes 300 from among theplurality of light emitting diodes 300 are arranged at a distance from(e.g., are spaced from) the first electrode 201 and the second electrode202. Accordingly, all or substantially all of the plurality of lightemitting diodes 300 arranged between the first electrode 201 and thesecond electrode 202 emit light even though some of the plurality oflight emitting diodes 300 arranged between the first electrode 201 andthe second electrode 202 are separated from the first electrode 201 orthe second electrode 202 during the manufacturing process (e.g., are notadequately or sufficiently aligned during the manufacturing process).

At least one insulation pattern is disposed between the first contact600 and the second contact 700. For example, the insulation pattern 800is provided on the plurality of light emitting diodes 300 and isdisposed between the first contact 600 and the second contact 700.

The insulation pattern 800 contacts the first contact 600, the secondcontact 700, and the light emitting diodes 300. The insulation pattern800 prevents a short circuit between the first contact 600 and thesecond contact 700.

In some embodiments, the insulation pattern 800 is provided as a singlelayer and completely covers the first electrode 201.

The insulation pattern 800 includes a material selected from an organicmaterial and an inorganic material.

In the light emitting display according to the above-described exemplaryembodiment, the first contact 600 directly connects the first lightemitting diodes 301 and the first electrode 201 to ensure that the firstlight emitting diodes 301 are not separated from the substrate 100.

For example, because the plurality of light emitting diodes 300 are notseparated from the first electrode 201 and the second electrode 202during the manufacturing process, the number of light emitting diodes300 disposed between the first electrode 201 and the second electrode202 can be increased.

In addition, in the light emitting device 1000 according to theexemplary embodiment, light irradiated from the plurality of lightemitting diodes 300 in a direction toward the first protrusion 500 isreflected upwardly by the portion of the second electrode 202 that isprotruded by the first protrusion 500, thereby improving the lightemission efficiency of the plurality of light emitting diodes 300.

Further, in the light emitting device according to the exemplaryembodiment, the plurality of light emitting diodes 300 are connected tothe first electrode 201 and the second electrode 202 by the firstcontact 600 and the second contact 700 so that, even though some of thelight emitting diodes 300 are arranged at a distance from (e.g., arespaced from) the first electrode 201 and the second electrode 202 duringthe manufacturing process, all or substantially all of the plurality oflight emitting diodes 300 may be connected to the first electrode 201and the second electrode 202.

For example, in the light emitting device (e.g., a light emitting diodedisplay) 1000, although some of the plurality of light emitting diodes300 arranged between the first electrode 201 and the second electrode202 are disposed at a distance from the first electrode 201 and/or thesecond electrode 202, all or substantially all of the light emittingdiodes 300 disposed between the first electrode 201 and the secondelectrode 202 may emit light.

In addition, in the light emitting device 1000 according to theexemplary embodiment, the first electrode 201 and the second electrode202 between which the plurality of light emitting diodes 300 arearranged may not short-circuit with each other due to undesirableparticles introduced during a process for forming the first contact 600.

This will be described in more detail with reference to a method ofmanufacturing a light emitting device according to another exemplaryembodiment.

Hereinafter, referring to FIGS. 3-7, a light emitting device of theabove-described exemplary embodiment may be manufactured by using amethod of manufacturing a light emitting device according to anotherexemplary embodiment, but the present invention is not limited thereto.The above-described light emitting device may be manufactured by usingthe manufacturing method of a light emitting device according to anotherembodiment, and the present invention is not limited to the describedembodiment.

FIG. 3 is a flowchart of a method of manufacturing a light emittingdevice according to another exemplary embodiment.

FIGS. 4-7 are cross-sectional views of the method of manufacturing thelight emitting device illustrated in FIG. 3.

First, referring to FIGS. 3 and 4, a plurality of light emitting diodes300 are coated on a first electrode 201 and second electrodes 202 of asubstrate 100 (S100).

For example, the plurality of light emitting diodes 300 are coated onthe first electrode 201 and the second electrodes 202 that extend in onedirection while having a distance from each other (e.g., while beingspaced from or separated from each other) on the substrate 100.

A first protrusion 500 is provided through a photolithography process ona substrate main body 110, on which a buffer layer 120 is formed, andthe first electrode 201 and the second electrode 202 are formed througha photolithography process. In this embodiment, the second electrode 202overlaps the first protrusion 500, and the first electrode 201 isdisposed between neighboring second electrodes 202.

The plurality of light emitting diodes 300 are coated on the firstelectrode 201 and the second electrodes 202 in the form of ink or pastemixed with a solvent by a coating device, such as an inkjet printer. Aswill be described in more detail below, when the solvent evaporates, theplurality of light emitting diodes 300 are arranged on (e.g., dried orformed on) the first electrode 201 and the second electrodes 202. Insome instances, particles 10 inadvertently mixed in the solvent orinjected during the manufacturing process are also disposed on at leastone of the first electrode 201, the second electrodes 202, and theplurality of light emitting diodes 300.

Next, the plurality of light emitting diodes 300 are arranged betweenthe first electrode 201 and the second electrodes 202 (S200).

For example, an electromagnetic field is formed between the firstelectrode 201 and the second electrode 202 by applying power to thefirst electrode 201 and the second electrode 202. The plurality of lightemitting diodes 300 are arranged between the first electrode 201 and thesecond electrodes 202 by the electromagnetic field formed between thefirst electrode 201 and the second electrodes 202.

Next, a first contact layer 601 is formed covering the first electrode201, the second electrode 202, and the plurality of light emittingdiodes 300 (S300).

For example, the first contact layer 601 is formed on the substrate 100by using a deposition process or a coating process. The first contactlayer 601 covers the first electrode 201, the second electrode 202, andthe plurality of light emitting diodes 300.

In the illustrated embodiment, the first contact layer 601 contacts thefirst electrode 201, the second electrode 202, the plurality of lightemitting diodes 300, and the particles 10. The particles 10 may bedisposed inside of the first contact layer 610.

Next, referring to FIG. 6, the first contact 600 is formed by etchingthe first contact layer 601 (S400).

For example, the first contact layer 601 is etched by using a photomask30 such that the first contact 600 that contacts the first electrode 201and a first portion of the light emitting diode 300 is formed.

A photoresist layer is formed on the first contact layer 601, and thephotoresist layer is exposed and developed by using an exposure mask toform the photomask 30 that overlaps the first electrode 201 and thefirst portion of the light emitting diode 300 on the first contact layer610, and then, the first contact layer 601 is wet-etched or dry-etchedby using the photomask 30 such that the first contact 600 that contactsthe first electrode 201 and the first portion of the light emittingdiode 300 is formed.

The particles 10 on the substrate 100 and contacting the first contactlayer 601 are removed as the first contact layer 601 is etched.

In other embodiments, the substrate 100 may be cleaned. As the substrate100 is cleaned, the particles 10 on the substrate 100 may be removed.

When the substrate 100 is cleaned, the plurality of light emittingdiodes 300 may not be separated from between the first electrode 201 andthe second electrode 202 because the first contact 600 contacts thefirst electrode 201 and the plurality of light emitting diodes 300.

In addition, because the particles 10 on the substrate 100 are removed,the first electrode 201 and the second electrode 202 may not beshort-circuited with each other due to the particles 10.

Next, referring to FIG. 7, an insulation pattern 800 that covers thefirst contact 600 is formed (S500).

For example, an insulation layer is formed on the first contact 600, andthen, the insulation layer is etched by using a photolithography processto form the insulation pattern 800.

Next, a second contact 700 is formed on the insulation pattern 800(S600).

For example, a conductive layer is formed on the insulation pattern 800,and the conductive layer is etched through a photolithography process toform the second contact 700.

According to the method of manufacturing the light emitting device ofthe above-described exemplary embodiment, the first contact 600 contactsthe first electrode 201 and the plurality of light emitting diodes 300when the substrate 100 is cleaned such that the plurality of lightemitting diodes 300 are not separated between the first electrode 201and the second electrode 202.

For example, because the plurality of light emitting diodes 300 are notseparated from between the first electrode 201 and the second electrode202 during the manufacturing process, the number of light emittingdiodes 300 arranged between the first electrode 201 and the secondelectrode 202 is increased.

In addition, in the method of manufacturing the light emitting deviceaccording to the above-described exemplary embodiment, the particles 10on the substrate 100 can be removed by forming the first contact 600such that the first electrode 201 and the second electrode 202 may notbe short-circuited with each other by the particles 10.

Further, in the method of manufacturing the light emitting diode displayaccording to the exemplary embodiment, a first mask is used in thephotolithography process for forming the first protrusion 500, a secondmask is used in the photolithography process for forming the firstelectrode 201 and the second electrode 202, a third mask is used in thephotolithography process for forming the first contact 600, a fourthmask is used in the photolithography process for forming the insulationpattern 800, and a fifth mask is used in the photolithography processfor forming the second contact 700. That is, a total of five masks areused to manufacture the light emitting device.

Hereinafter, light emitting devices according to other exemplaryembodiments will be described with reference to FIGS. 8-12.

Hereinafter, for ease of description, differences between theembodiments illustrated in FIGS. 8-12 and the above-describedembodiments will be primarily described.

FIG. 8 is a cross-sectional view of a light emitting device.

Referring to FIG. 8, a light emitting device 1002 according to anotherexemplary embodiment includes a substrate 100, a first electrode 201,second electrodes 202, light emitting diodes 300, first protrusions 500,a first contact 600, second contacts 700, and an insulation pattern 800.

The light emitting diodes 300 are disposed between the first electrode201 and the second electrodes 202. One end of each of the light emittingdiodes 300 is disposed on the first electrode 201, and the other endthereof is disposed on one of the second electrodes 202.

The light emitting diode 300 is supported by the first electrode 201 andthe second electrode 202. The light emitting diodes 300 are disposedapart from the substrate 100 and are spaced apart from the entiresurface of the substrate 100.

FIG. 9 is a cross-sectional view of a light emitting device according tostill another exemplary embodiment.

Referring to FIG. 9, a light emitting device 1003 according to anotherexemplary embodiment includes a substrate 100, a first electrode 201, asecond electrode 202, a light emitting diode 300, a first protrusion500, a first contact 600, a second contact 700, an insulation pattern800, and a second protrusion (e.g., a second protrusion portion) 900.

The light emitting diode 300 is disposed between the first electrode 201and the second electrode 202. The light emitting diode 300 contacts(e.g., is directly on) the substrate 100. The light emitting diode 300contacts the first contact 600 and, thus, is connected to the firstelectrode 201, and contacts the second contact 700 and, thus, isconnected to the second electrode 202 (e.g., the light emitting diode300 is electrically connected to the first and second electrodes 201 and202 via the first and second contacts 600 and 700, respectively).

The second protrusion 900 is disposed between the substrate 100 and thefirst electrode 201. A portion of the first electrode 201 on the secondprotrusion 900 is protruded upwardly from the substrate 100.

Light that is emitted from the light emitting diode 300 toward the firstand second protrusions 500 and 900 may be reflected in the top sidedirection by the portion of the second electrode 202 that is protrudedby the first protrusion 500 and the portion of the first electrode 201that is protruded by the second protrusion 900. Accordingly, lightemission efficiency of the light emitting diode 300 may be improved.

The insulation pattern 800 extends from the light emitting diode 300over the first contact 600 to the first electrode 201.

The insulation pattern 800 completely covers the first contact 600 andthe first electrode 201.

FIG. 10 is a cross-sectional view of a light emitting device accordingto still another exemplary embodiment.

Referring to FIG. 10, a light emitting device 1004 according to anotherexemplary embodiment includes a substrate 100, a first electrode 201, asecond electrode 202, a light emitting diode 300, a first protrusion500, a first contact 600, a second contact 700, an insulation pattern800, and a second protrusion 900.

The light emitting diode 300 is disposed between the first electrode 201and the second electrode 202. The light emitting diode 300 contacts thesubstrate 100. The light emitting diode 300 contacts the first contact600 and, thus, is connected to the first electrode 201, and contacts thesecond contact 700 and, thus, is connected to the second electrode 202.

The second protrusion 900 is disposed between the substrate 100 and thefirst electrode 201. A portion of the first electrode 201 on the secondprotrusion 900 is protruded upwardly from the substrate 100.

The insulation pattern 800 extends from the light emitting diode 300 toover a portion of the first contact 600.

The insulation pattern 800 covers some of the first contact 600 and someof the first electrode 201.

FIG. 11 is a cross-sectional view of a light emitting device accordingto still another exemplary embodiment.

Referring to FIG. 11, a light emitting device 1005 according to anotherexemplary embodiment includes a substrate 100, a first electrode 201, asecond electrode 202, a light emitting diode 300, a first protrusion500, a first contact 600, a second contact 700, an insulation pattern800, and a second protrusion 900.

The light emitting diode 300 is disposed between the first electrode 201and the second electrode 202. The light emitting diode 300 contacts thesubstrate 100. One end of the light emitting diode 300 contacts both thefirst contact 600 and the first electrode 201, and the other end of thelight emitting diode 300 contacts both the second contact 700 and thesecond electrode 202.

The second protrusion 900 is disposed between the substrate 100 and thefirst electrode 201. A portion of the first electrode 201 on the secondprotrusion 900 protrudes upwardly from the substrate 100.

The insulation pattern 800 extends from the light emitting diode 300over the first contact 600 to the first electrode 201.

The insulation pattern 800 completely covers the first contact 600 andthe first electrode 201.

The light emitting diode 300 is disposed between the first electrode 201and the second electrode 202. One end of the light emitting diode 300 isdisposed on the first electrode 201, and the other end thereof isdisposed on the second electrode 202.

The light emitting diode 300 is supported by the first electrode 201 andthe second electrode 202. The light emitting diode 300 is disposed apartfrom the substrate 100 and is spaced apart from the entire surface ofthe substrate 100.

FIG. 12 is a cross-sectional view of a light emitting device accordingto still another exemplary embodiment.

Referring to FIG. 12, a light emitting device 1006 according to anotherexemplary embodiment includes a substrate 100, a first electrode 201, asecond electrode 202, a light emitting diode 300, a first protrusion500, a first contact 600, a second contact 700, an insulation pattern800, and a second protrusion 900.

The light emitting diode 300 is disposed between the first electrode 201and the second electrode 202. The light emitting diode 300 contacts thesubstrate 100. One end of the light emitting diode 300 contacts both thefirst contact 600 and the first electrode 201, and the other end of thelight emitting diode 300 contacts both the second contact 700 and thesecond electrode 202.

The second protrusion 900 is disposed between the substrate 100 and thefirst electrode 201. A portion of the first electrode 201 on the secondprotrusion 900 protrudes upwardly from the substrate 100.

The insulation pattern 800 extends from the light emitting diode 300 tocover a portion of the first contact 600.

The insulation pattern 800 covers some of the first contact 600 and someof the first electrode 201.

The light emitting diode 300 is disposed between the first electrode 201and the second electrode 202. One end of the light emitting diode 300 isdisposed on the first electrode 201, and the other end thereof isdisposed on the second electrode 202.

The light emitting diode 300 is supported by the first electrode 201 andthe second electrode 202. The light emitting diode 300 is disposed apartfrom the substrate 100 and is spaced from the entire surface of thesubstrate 100.

While the present invention has been described in connection with whatis presently considered to be practical exemplary embodiments, it is tobe understood that the present invention is not limited to the disclosedembodiments. The present invention is intended to cover variousmodifications and equivalent arrangements included within the spirit andscope of the appended claims and their equivalents.

What is claimed is:
 1. A light emitting device comprising: a substrate;a first electrode and a second electrode on the substrate and spacedapart from each other; a first protrusion between the substrate and thesecond substrate; a light emitting diode between the first electrode andthe second electrode, the light emitting diode being electricallyconnected to the first electrode and the second electrode; an insulationpattern on the light emitting diode; a first contact contacting thefirst electrode and a first portion of the light emitting diode; and asecond contact contacting a second portion of the light emitting diodeand the second electrode, wherein the first electrode and the secondelectrode do not contact the light emitting diode, wherein the secondcontact comprises a first portion directly contacting the secondelectrode, a second portion directly contacting the second portion ofthe light emitting diode, and a third portion directly contacting a sidesurface of the insulation pattern.
 2. The light emitting device of claim1, wherein the first portion of the second contact overlaps the firstprotrusion.
 3. The light emitting device of claim 2, wherein the secondelectrode includes a lower surface facing the substrate and an uppersurface opposite the lower surface, wherein the first protrusion isbetween the substrate and the lower surface of the second substrate, andwherein the first portion of the second contact directly contacts theupper surface of the second electrode.
 4. The light emitting device ofclaim 1, wherein the insulation pattern comprises an organic material.5. The light emitting device of claim 1, wherein the insulation patternincludes a lower surface facing the substrate, an upper surface oppositeto the lower surface and the side surface connected to the lower surfaceand the upper surface, wherein the upper surface of the insulationpattern directly contacts the second contact.
 6. The light emittingdevice of claim 1, wherein the light emitting diode includes a sidesurface facing the first protrusion, and wherein the second portion ofthe second contact directly contacts the side surface of the lightemitting diode.
 7. The light emitting device of claim 1, furthercomprising a second protrusion between the substrate and the firstelectrode.
 8. A light emitting device comprising: a substrate; a firstelectrode and a second electrode on the substrate and spaced apart fromeach other; a light emitting diode between the first electrode and thesecond electrode, the light emitting diode being electrically connectedto the first electrode and the second electrode, the light emittingdiode including a lower surface facing the substrate, an upper surfaceopposite the lower surface, and a side surface between the lower surfaceand the upper surface; a first contact contacting the first electrodeand a first portion of the light emitting diode; and a second contactcontacting a second electrode and directly contacting the side surfaceof the light emitting diode, wherein the first electrode and the secondelectrode do not contact the light emitting diode, and wherein the sidesurface of the light emitting diode faces the second substrate.
 9. Thelight emitting device of claim 8, further comprising an insulationpattern on the light emitting diode, wherein a portion of the secondcontact directly contacts a side surface of the insulation pattern. 10.The light emitting device of claim 9, wherein the insulation patterncomprises an organic material.
 11. The light emitting device of claim 8,further comprising a first protrusion between the substrate and thesecond electrode, wherein a portion of the second contact overlaps thefirst protrusion, and wherein the portion of the second contact directlycontacts the second electrode.
 12. A method of manufacturing a lightemitting device, the method comprising: forming a first electrode and asecond electrode on a substrate, the first electrode and the secondelectrode being spaced apart from each other on the substrate; coating alight emitting diode on the substrate; aligning the light emitting diodebetween the first electrode and the second electrode by forming anelectric field between the first electrode and the second electrode;forming a first contact layer covering the first electrode, the secondelectrode, and the light emitting diode; forming a first contactcontacting the first electrode and a first portion of the light emittingdiode by etching the first contact layer using a mask; and forming asecond contact contacting the second electrode and a second portion ofthe light emitting diode, wherein the first electrode and the secondelectrode do not contact the light emitting diode.
 13. The method ofmanufacturing the light emitting device of claim 12, further comprisingforming an insulation pattern between the first contact and the secondcontact.
 14. The method of manufacturing the light emitting device ofclaim 12, wherein the forming of the first contact comprises removingparticles formed on the substrate and contacting the first contactlayer.